Solder Lead-Free, ø 0.56 mm, 100 g

0.3 % silver, 0.7 % copper, 99 % tin, content of flux core: 2.5 %, melting point 217 °C
Flux-filled solder wire with a thin diameter of 0.56 mm for particularly easy dispensing and soldering of delicate components
Simple, homogeneous wetting of the solder joint thanks to the rosin flux core
No-clean solution with continuous flux cores that does not require cleaning the solder joint after use
Reduced spattering for increased user safety and protection of the workpiece
Halogen-free and with low smoke emission
Perfect for soft soldering at low temperatures up to 450 °C in the automated and hand soldering area
In full flow: With its narrow diameter, the tin is easy to dispense and ideal for precision work, e.g. for soldering electrical components and devices such as printed circuit boards, SMDs, DIPs, cables, televisions, headphones or microphones.
The integrated no-clean flux is particularly convenient, as you do not need to remove it from the joint after soldering.