Код товара:52781
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For electronic components requiring effective cooling
Effective heat dissipation and precise surface filling
Qoltec Thermal Putty 4 W/m-K is a thermally conductive compound designed to improve heat transfer between heat-generating electronic components and cooling elements. Thanks to its dense, malleable consistency, it conforms precisely to surfaces and fills minor irregularities and gaps, minimising the formation of air pockets that hinder heat dissipation.
Thermal conductivity of 4 W/m-K
A thermal conductivity of 4 W/m·K facilitates the efficient transfer of heat to a heat sink or other component of the cooling system. The compound can be used with electronic components requiring improved thermal contact, including integrated circuits, memory modules, power supply sections and other heat-generating components.
Better thermal contact between the component and the heat sink
High thermal conductivity, excellent insulation and easy application
Qoltec thermal paste is a top-quality product that offers:
- high thermal conductivity of 4 W/m·K, ensuring effective heat dissipation,
- enhanced heat transfer between the component and the heat sink,
- high quality: the paste’s properties do not deteriorate over time, ensuring stable performance for years to come,
- thick, malleable consistency, easy to apply, allowing you to precisely fill all micro-gaps between individual components,
- yield: net weight 100 g,
Thick consistency, precise filling of gaps
The malleable consistency of Thermal Putty
Unlike traditional thin thermal paste, Thermal Putty has a thick and mouldable texture, allowing it to fill larger gaps between the component being cooled and the heat sink. It allows the layer of material to be precisely moulded to the shape of the surface and makes application easier in hard-to-reach areas. 100 g of product for servicing and technical applications
The pack contains 100 g of pink thermal paste, making the product suitable for both one-off repairs and more frequent servicing tasks. It is a practical solution for computer repair shops, electronics technicians and users involved in the maintenance and upgrading of equipment.
Confidence confirmed by a warranty
This product comes with a 24-month warranty
Do you want to be sure of the high quality of the product you’re buying? Our solutions will meet your expectations. Each of the thermal pastes we offer comes with a 24-month warranty valid from the date of purchase.
Effective heat dissipation and precise surface filling
Qoltec Thermal Putty 4 W/m-K is a thermally conductive compound designed to improve heat transfer between heat-generating electronic components and cooling elements. Thanks to its dense, malleable consistency, it conforms precisely to surfaces and fills minor irregularities and gaps, minimising the formation of air pockets that hinder heat dissipation.
Thermal conductivity of 4 W/m-K
A thermal conductivity of 4 W/m·K facilitates the efficient transfer of heat to a heat sink or other component of the cooling system. The compound can be used with electronic components requiring improved thermal contact, including integrated circuits, memory modules, power supply sections and other heat-generating components.
Better thermal contact between the component and the heat sink
High thermal conductivity, excellent insulation and easy application
Qoltec thermal paste is a top-quality product that offers:
- high thermal conductivity of 4 W/m·K, ensuring effective heat dissipation,
- enhanced heat transfer between the component and the heat sink,
- high quality: the paste’s properties do not deteriorate over time, ensuring stable performance for years to come,
- thick, malleable consistency, easy to apply, allowing you to precisely fill all micro-gaps between individual components,
- yield: net weight 100 g,
Thick consistency, precise filling of gaps
The malleable consistency of Thermal Putty
Unlike traditional thin thermal paste, Thermal Putty has a thick and mouldable texture, allowing it to fill larger gaps between the component being cooled and the heat sink. It allows the layer of material to be precisely moulded to the shape of the surface and makes application easier in hard-to-reach areas. 100 g of product for servicing and technical applications
The pack contains 100 g of pink thermal paste, making the product suitable for both one-off repairs and more frequent servicing tasks. It is a practical solution for computer repair shops, electronics technicians and users involved in the maintenance and upgrading of equipment.
Confidence confirmed by a warranty
This product comes with a 24-month warranty
Do you want to be sure of the high quality of the product you’re buying? Our solutions will meet your expectations. Each of the thermal pastes we offer comes with a 24-month warranty valid from the date of purchase.
Thermal conductivity: 4 W/m-K
Thermal resistance: 0,028 °C in²/W
Specific gravity: 3,0–3,2
Dielectric constants: 3,2 at 1 MHz
Additional information: Loss on drying after 96 hours at 100°C: 0.005% Density: 3.0–3.1 g/ml Dielectric strength: 5.2 kV/mm Shelf life: 5 years Odour: Odourless
Colour: Pink
Operating temperature: -20˚C ~ +50˚C
Dimensions (D/L x W x H): 60 x 60 x 55 mm
Package: Plastic container
Package contents: 1 x Thermal putty 100g
Package depth / length [mm]: 60
Package width [mm]: 60
Package height [mm]: 55
Net weight [kg]: 0.100
Gross weight [kg]: 0.124
Thermal resistance: 0,028 °C in²/W
Specific gravity: 3,0–3,2
Dielectric constants: 3,2 at 1 MHz
Additional information: Loss on drying after 96 hours at 100°C: 0.005% Density: 3.0–3.1 g/ml Dielectric strength: 5.2 kV/mm Shelf life: 5 years Odour: Odourless
Colour: Pink
Operating temperature: -20˚C ~ +50˚C
Dimensions (D/L x W x H): 60 x 60 x 55 mm
Package: Plastic container
Package contents: 1 x Thermal putty 100g
Package depth / length [mm]: 60
Package width [mm]: 60
Package height [mm]: 55
Net weight [kg]: 0.100
Gross weight [kg]: 0.124
