27-piece BGA soldering stencil set P:0.45...1.5mm

SKU:OKYN1115-6
Manufacturer:Okystar
27-piece BGA soldering stencil set P:0.45...1.5mm
Image is for illustrative purposes only
This universal set contains 27 stencils designed for reballing BGA microchips, simplifying and accelerating the restoration of solder ball connections.

Key Features
- Direct Heat Compatibility: The stencils are manufactured from high-quality stainless steel, allowing them to be heated directly with a hot air gun for an efficient workflow.
- Comprehensive Coverage: This 27-piece set is suitable for a wide range of the most common BGA chips.
- Efficient Design: Each stencil is engineered to ensure a precise match between the grid area and the chip, which helps to minimize solder ball waste.
Material: Stainless steel
Quantity: 27 pcs
Set contents:
Universal stencil (P=1.5mm): 1 pc, 48mm×48mm
Universal stencil 0.25 (P=0.5mm): 1 pc, 35mm×35mm
Universal stencil 0.30 (P=0.5mm): 2 pcs, 30mm×30mm, 35mm×35mm
Universal stencil 0.35 (P=0.6mm): 2 pcs, 30mm×30mm, 35mm×35mm
Universal stencil 0.40 (P=0.78mm): 1 pc, 35mm×35mm
Universal stencil 0.45 (P=0.78mm): 1 pc, 35mm×35mm
Universal stencil 0.5 (P=0.8mm): 3 pcs, 31mm×31mm, 35mm×35mm, 40mm×40mm
Universal stencil 0.55 (P=1.0mm): 1 pc, 50mm×50mm
Universal stencil 0.6 (P=0.9mm): 1 pc, 45mm×45mm
Universal stencil 0.6 (P=1.1mm): 1 pc, 32mm×32mm

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