Solder Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4

SKU:TS391LT
Manufacturer:ChipQuick
New Solder Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
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The Chip Quik TS391LT is a thermostable, lead-free, No-Clean solder paste specifically formulated with a low melting point (138°C) for working with heat-sensitive electronic components. This unique formula eliminates the requirement for refrigeration storage.



Key Specifications and Features

- Alloy Composition: Sn42/Bi57.6/Ag0.4 low-temperature alloy

- Melting Point: 138°C

- Flux Classification: ROL0 No-Clean, leaving a transparent residue

- Particle Size: Type T4 (20-38 µm), ensuring excellent dispensing and application

- Performance: Provides superior wetting characteristics

- Packaging: 5 cc (15 g) syringe

- Compliance: Meets RoHS3 and REACH requirements



Applications

This paste is ideally suited for soldering applications involving components or substrates that are highly sensitive to standard reflow temperatures.
Alloy Composition: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic No Clean (ROL0)
Melting Temperature: 138°C
Mesh Type: T4 (20-38 µm)
Metal Content: 87% by weight
Weight/Form: 15g (5cc syringe)
Storage Requirements: 20-25°C (room temperature), no refrigeration required
Shelf Life: 12 months (from date of manufacture)
Compliance: RoHS3, REACH
TS391LT Datasheet EN207.65KB
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