Solderless Breadboard – 830 Tie Points (ZY-201)
SKU:OKY0022-1
Manufacturer:Okystar
Image is for illustrative purposes only
The Okystar OKY0022-1 (ZY-201) is a solderless breadboard designed for the rapid prototyping of electronic circuits.
Key Features
- Provides a total of 830 tie-points, organized into a 630-point terminal strip and two 200-point distribution buses for power.
- Equipped with three binding posts for a convenient and secure connection to an external power supply.
- Accepts a wide range of solid-core wire sizes, from 20 to 29 AWG.
- Features clear, color-coded markings to simplify component placement and wiring.
Applications
This breadboard is an ideal tool for a variety of uses, including DIY electronics projects, engineering experiments, and educational purposes in classrooms or labs where frequent circuit modification is necessary.
Key Features
- Provides a total of 830 tie-points, organized into a 630-point terminal strip and two 200-point distribution buses for power.
- Equipped with three binding posts for a convenient and secure connection to an external power supply.
- Accepts a wide range of solid-core wire sizes, from 20 to 29 AWG.
- Features clear, color-coded markings to simplify component placement and wiring.
Applications
This breadboard is an ideal tool for a variety of uses, including DIY electronics projects, engineering experiments, and educational purposes in classrooms or labs where frequent circuit modification is necessary.
Total tie-points: 830
Terminal strip: 1 (630 tie-points)
Distribution strips: 2 (200 tie-points)
Binding posts: 3
Material: ABS plastic
Base plate: Aluminum plate
Board size: 16.5 x 5.4 x 0.85 cm
Supported wire gauge: 20-29 AWG
Terminal strip: 1 (630 tie-points)
Distribution strips: 2 (200 tie-points)
Binding posts: 3
Material: ABS plastic
Base plate: Aluminum plate
Board size: 16.5 x 5.4 x 0.85 cm
Supported wire gauge: 20-29 AWG
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WB-104-329.00 €Customer price27.55 €-5%
