Semiconductor refrigeration TEC1-12703 40*40mm-OKY3550-3
SKU:OKY3550-3
Manufacturer:Okystar
The TEC1-12703 is a solid-state thermoelectric cooler module that utilizes the Peltier effect to provide active cooling. It is designed to create a significant temperature difference between its two sides when powered, making it ideal for localized cooling tasks.
Key Features
- Model: TEC1-12703
- Dimensions: Features a standard 40x40mm footprint with a slim 4.0mm profile.
- Operating Voltage: Designed for a nominal 12V DC power supply, with a maximum voltage of 15.5V.
- Performance: Draws 3A of current to deliver a maximum cooling power (Qcmax) of 27W.
- Temperature Differential: Achieves a maximum temperature difference (ΔTmax) of over 60°C between the hot and cold sides.
- Construction: Built with 127 internal semiconductor pairs for efficient thermal transfer.
- Leads: Includes pre-attached lead wires approximately 310mm in length.
Applications
This module is well-suited for a wide range of industrial and consumer devices requiring precise spot cooling, such as custom electronics coolers, portable coolers, or scientific instrumentation.
Operational Requirement
For effective and sustained performance, a heatsink must be installed on the hot side of the module to properly dissipate heat.
Key Features
- Model: TEC1-12703
- Dimensions: Features a standard 40x40mm footprint with a slim 4.0mm profile.
- Operating Voltage: Designed for a nominal 12V DC power supply, with a maximum voltage of 15.5V.
- Performance: Draws 3A of current to deliver a maximum cooling power (Qcmax) of 27W.
- Temperature Differential: Achieves a maximum temperature difference (ΔTmax) of over 60°C between the hot and cold sides.
- Construction: Built with 127 internal semiconductor pairs for efficient thermal transfer.
- Leads: Includes pre-attached lead wires approximately 310mm in length.
Applications
This module is well-suited for a wide range of industrial and consumer devices requiring precise spot cooling, such as custom electronics coolers, portable coolers, or scientific instrumentation.
Operational Requirement
For effective and sustained performance, a heatsink must be installed on the hot side of the module to properly dissipate heat.
Assembly Pressure: 85N/cm2
Chip Type: TEC1-12703
Cooling Power: Qcmax 27W
Dimensions: 40 x 40 x 4.0mm ± 0.1
Internal Resistance: 4.0 ~ 4.3Ω (at ambient temperature 23 ± 1℃, 1kHz AC test)
Maximum Temperature Difference: △Tmax (Qc=0) >60℃
Nominal Voltage: DC12V (Vmax: 15.5V)
Operating Current: Imax = 3A (at 12V nominal voltage)
Storage Conditions: -40℃ ~ 60℃
Wire Specifications: Length 310mm ± 5mm RV standard wire, 5mm tinned
Working Environment: -55℃ ~ 83℃
Chip Type: TEC1-12703
Cooling Power: Qcmax 27W
Dimensions: 40 x 40 x 4.0mm ± 0.1
Internal Resistance: 4.0 ~ 4.3Ω (at ambient temperature 23 ± 1℃, 1kHz AC test)
Maximum Temperature Difference: △Tmax (Qc=0) >60℃
Nominal Voltage: DC12V (Vmax: 15.5V)
Operating Current: Imax = 3A (at 12V nominal voltage)
Storage Conditions: -40℃ ~ 60℃
Wire Specifications: Length 310mm ± 5mm RV standard wire, 5mm tinned
Working Environment: -55℃ ~ 83℃