Solder paste with lead No-Clean 15g in syringe Sn63/Pb37 T4
SKU:TS391AX
Manufacturer:ChipQuick
Image is for illustrative purposes only
Chip Quik’s thermally stable solder paste features a revolutionary formula that eliminates the need for refrigeration, ensuring easy handling and long-term reliability. This innovative product provides a long stencil life exceeding 12 hours under standard conditions, combined with a wide process window that suits various manufacturing environments. It is designed for high-performance applications, supporting printing speeds of up to 125mm/sec and offering excellent wetting compatibility across most board finishes.
The paste is engineered to deliver professional results with minimal voiding and clear residue post-reflow. Its unique synthetic flux allows the product to be stored at room temperature for over 12 months without degrading, meaning no warming time is required before you begin work. Whether using automated print heads or manual dispensing, this leaded solder paste provides consistent, high-quality connections.
The paste is engineered to deliver professional results with minimal voiding and clear residue post-reflow. Its unique synthetic flux allows the product to be stored at room temperature for over 12 months without degrading, meaning no warming time is required before you begin work. Whether using automated print heads or manual dispensing, this leaded solder paste provides consistent, high-quality connections.
Alloy: Sn63/Pb37
Mesh Size: T4
Micron (μm) Range: 20-38
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Load: 88% Metal by Weight
Melting Point: 183°C (361°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >12 months, Unrefrigerated >12 months
Print Speed: 25-125mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life: >12 hours @ 20-50% RH (22-28°C), >4 hours @ 50-70% RH (22-28°C)
Stencil Cleaning: Automated systems or manual cleaning using isopropyl alcohol (IPA)
Storage and Handling: Store at room temperature 20-25°C (68-77°F), Do not freeze
Transportation: No shipping restrictions, stable for ground or air transit
Copper Mirror Test: L: No breakthrough (IPC-TM-650: 2.3.32)
Corrosion Test: L: No corrosion (IPC-TM-650: 2.6.15)
Quantitative Halides: L: <0.05% (IPC-TM-650: 2.3.28.1)
Electrochemical Migration: L: <1 decade drop (IPC-TM-650: 2.6.14.1)
Surface Insulation Resistance: L: ≥100MΩ (IPC-TM-650: 2.6.3.7)
Tack Value: 33g (IPC-TM-650: 2.4.44)
Viscosity (Malcom): Print: 140-195, Dispense: 115-160 (x10³ mPa/s)
Visual Test: Clear and free from precipitation (IPC-TM-650: 3.4.2.5)
Conflict Minerals Compliance: EICC Compliant
REACH Compliance: Contains Lead (Pb), no other SVHC present
Industry Standards: Conforms to J-STD-004B (Amendment 1), J-STD-005A, J-STD-006C
RoHS 3 Directive (EU) 2015/863: No
What's included: 15g solder paste in syringe
Mesh Size: T4
Micron (μm) Range: 20-38
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Load: 88% Metal by Weight
Melting Point: 183°C (361°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >12 months, Unrefrigerated >12 months
Print Speed: 25-125mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life: >12 hours @ 20-50% RH (22-28°C), >4 hours @ 50-70% RH (22-28°C)
Stencil Cleaning: Automated systems or manual cleaning using isopropyl alcohol (IPA)
Storage and Handling: Store at room temperature 20-25°C (68-77°F), Do not freeze
Transportation: No shipping restrictions, stable for ground or air transit
Copper Mirror Test: L: No breakthrough (IPC-TM-650: 2.3.32)
Corrosion Test: L: No corrosion (IPC-TM-650: 2.6.15)
Quantitative Halides: L: <0.05% (IPC-TM-650: 2.3.28.1)
Electrochemical Migration: L: <1 decade drop (IPC-TM-650: 2.6.14.1)
Surface Insulation Resistance: L: ≥100MΩ (IPC-TM-650: 2.6.3.7)
Tack Value: 33g (IPC-TM-650: 2.4.44)
Viscosity (Malcom): Print: 140-195, Dispense: 115-160 (x10³ mPa/s)
Visual Test: Clear and free from precipitation (IPC-TM-650: 3.4.2.5)
Conflict Minerals Compliance: EICC Compliant
REACH Compliance: Contains Lead (Pb), no other SVHC present
Industry Standards: Conforms to J-STD-004B (Amendment 1), J-STD-005A, J-STD-006C
RoHS 3 Directive (EU) 2015/863: No
What's included: 15g solder paste in syringe
