029 2-component Silicone Encapsulating Compound 100g+10g Grey 2W/mK
SKU:AGT-221
Manufacturer:AG TermoPasty
Image is for illustrative purposes only
The 029 Two-Component Silicone Potting Compound is a thermally conductive, condensation-curing material designed to protect sensitive electronic systems while ensuring efficient heat dissipation and robust environmental sealing. Key Features
- High thermal conductivity (2 W/mK) for effective heat transfer away from components.
- Provides long-term protection against moisture, dust, and mechanical vibration.
- Excellent electrical insulation with high dielectric strength (>20 kV/mm).
- Forms a durable, chemically resistant gray rubber upon curing, suitable for high-temperature exposure.
- Cured hardness of Shore A 63.
- Supplied in pre-measured proportions (100g A + 10g B) to simplify the mixing process.
Application Process
The application of Silicone Potting Compound 029 is straightforward but requires following a few steps to ensure optimal system protection.
Surface Preparation:Before starting the potting process, clean, degrease, and dry the electronic system. This crucial step ensures optimal adhesion and the effectiveness of the material’s protection.
Mixing the Components:The compound consists of two components – silicone base and catalyst – which must be thoroughly mixed in the correct proportions. Mixing can be done manually or mechanically, depending on the batch size, to achieve a homogeneous composition.
Air Removal:To avoid air bubbles, it is recommended to degas the mixture using a vacuum chamber. This step ensures the material will cure uniformly, without unwanted voids, improving its mechanical and thermal properties.
Application and Curing:After preparing the mixture, apply it precisely to the system. It is important to leave the system open after application to allow condensation products, such as ethanol, to evaporate. Curing at room temperature takes about 100 hours.
Applications
This compound is ideally suited for applications requiring both thermal management and robust environmental protection. Typical uses include potting for power supply electronics, control units (controllers), and demanding automotive systems.
- High thermal conductivity (2 W/mK) for effective heat transfer away from components.
- Provides long-term protection against moisture, dust, and mechanical vibration.
- Excellent electrical insulation with high dielectric strength (>20 kV/mm).
- Forms a durable, chemically resistant gray rubber upon curing, suitable for high-temperature exposure.
- Cured hardness of Shore A 63.
- Supplied in pre-measured proportions (100g A + 10g B) to simplify the mixing process.
Application Process
The application of Silicone Potting Compound 029 is straightforward but requires following a few steps to ensure optimal system protection.
Surface Preparation:Before starting the potting process, clean, degrease, and dry the electronic system. This crucial step ensures optimal adhesion and the effectiveness of the material’s protection.
Mixing the Components:The compound consists of two components – silicone base and catalyst – which must be thoroughly mixed in the correct proportions. Mixing can be done manually or mechanically, depending on the batch size, to achieve a homogeneous composition.
Air Removal:To avoid air bubbles, it is recommended to degas the mixture using a vacuum chamber. This step ensures the material will cure uniformly, without unwanted voids, improving its mechanical and thermal properties.
Application and Curing:After preparing the mixture, apply it precisely to the system. It is important to leave the system open after application to allow condensation products, such as ethanol, to evaporate. Curing at room temperature takes about 100 hours.
Applications
This compound is ideally suited for applications requiring both thermal management and robust environmental protection. Typical uses include potting for power supply electronics, control units (controllers), and demanding automotive systems.
Dielectric Strength: 20 kV/mm
Mixing Ratio (A:B): 100:10
Operating Temperature Range: -50°C to 200°C
Shore A Hardness: 63 A
Thermal Conductivity: 2 W/mK
Viscosity (Component A, at 25°C): 1455 cP
Mixing Ratio (A:B): 100:10
Operating Temperature Range: -50°C to 200°C
Shore A Hardness: 63 A
Thermal Conductivity: 2 W/mK
Viscosity (Component A, at 25°C): 1455 cP
