SKU:45238-GBY
Solder paste made from zinc chloride is designed for soft soldering of electronic components, electrical contacts, printed circuit boards (PCBs), SMD components, cables, copper, and tin. The paste effectively dissolves old solder and facilitates the creation of clean new solder joints.
The flux component reduces surface tension to ensure optimized wetting of the workpiece with solder. It prevents oxidation of the joint during the process, dissolves existing oxidation, and promotes the formation of the alloy during soldering.
The flux component reduces surface tension to ensure optimized wetting of the workpiece with solder. It prevents oxidation of the joint during the process, dissolves existing oxidation, and promotes the formation of the alloy during soldering.
Weight: 50 g
Length: 60 mm
Width: 60 mm
Height: 25 mm
Length: 60 mm
Width: 60 mm
Height: 25 mm
