Silicone encapsulating compound

The Silicone Potting Compound 011 (AGT-219) is a modern, two-component, condensation-curing material formulated for the reliable sealing and protection of electronic and electrical components.
This liquid casting material cures at room temperature (RTV) to form a stable, durable rubber-like compound.

Key Features

- Two-component silicone system utilizing condensation curing.

- Cures at room temperature.

- Exhibits high dielectric strength and volume resistivity.

- Excellent fluidity ensures complete gap filling, even in complex enclosures.

- Forms a stable, rubber-like material with low expansion.

- Provides resistance to delamination during thermal cycling.

Usage
Surface Preparation:Before starting the potting process, the electronic system should be thoroughly cleaned, degreased, and dried. This is a crucial step to ensure optimal adhesion and effective protection.
Mixing Components:The compound consists of two parts – the silicone base and a curing agent. These must be mixed thoroughly in the correct ratio. Mixing can be done manually or mechanically, depending on the batch size, to achieve a homogeneous composition.
Air Removal:To avoid air bubbles, it is recommended to degas the mixture using a vacuum chamber. This ensures that the material, once cured, is uniform and free of unwanted voids, improving its mechanical and thermal properties.
Application and Curing:Once the mixture is prepared, it should be precisely applied to the system. It is important to leave the system open after application to allow condensation by-products, such as ethanol, to escape. Curing at room temperature takes approximately 100 hours.
Applications

This compound provides robust protection against moisture, dust, and extreme temperatures, significantly extending the service life of sensitive systems.
It is ideally suited for the potting or gap filling of electronic components, energy converters, and power semiconductors, especially those utilizing metal housings.